His Articles

Compute Chips

Investment Insights from Hot Chips 2026 on the 2027 AI Chip Technology Roadmap

By mid‑2026, the AI hardware world has learned to treat Hot Chips not just as a technical conference, but as an unofficial preview of the next year’s capital flows. Architectures unveiled, packaging roadmaps hinted at, and memory strategies debated on stage all feed into how investors think about the 2027 AI chip landscape. When engineers share their plans, markets quietly rearrange expectations.

Macro Linkages

Sensitivity Stress Test of CNY Fluctuations on Domestic Equipment Import Costs

Exchange rates are often discussed as abstract macro variables, but for firms that import equipment they show up as very concrete line items: higher or lower invoice amounts, changed project budgets, revisions to CapEx plans. In China, where many of the most advanced production tools and capital goods are still imported and priced in foreign currencies—especially dollars, euros, and yen—fluctuations in the renminbi (CNY) can have a direct and sometimes material impact on domestic equipment import costs.

HBM Memory

HBM Re-rated from Cyclical to AI Growth Asset – A Valuation System Overhaul

High Bandwidth Memory (HBM) has long been categorized alongside other DRAM products as part of a cyclical commodity business, subject to booms and busts driven by general compute and consumer demand. In the AI era, that classification is increasingly inaccurate. As accelerators for training and inference depend more deeply on HBM for performance and energy efficiency, the asset’s economic profile is shifting from cycle-sensitive to structurally supported by long-term AI growth. This re-rating of HBM—from cyclic memory component to AI growth asset—forces a rethink of how investors, companies, and policymakers value and manage it.