His Articles

Macro Linkages

10Y Treasury Yield vs. Semi Valuations: The Critical Threshold

The relationship between the 10-year U.S. Treasury yield and semiconductor valuations has become one of the most closely watched macro-financial linkages in the technology market. Semiconductor companies are often valued on expectations of future earnings, long-term growth, technological leadership, and expanding demand from areas such as artificial intelligence, cloud computing, advanced networking, and automotive electronics. At the same time, those future cash flows are discounted against a market interest-rate environment that can change rapidly.

Macro Linkages

The Disappearance of Gold-Semi Negative Correlation During Crisis Periods

For years, gold and equities—especially high‑beta sectors like semiconductors—were seen as opposites in a portfolio. Gold was the safe haven; semis were the growth engine. When risk assets sold off, gold was supposed to rise, offering protection. When growth surged, gold might lag while semis rallied. That simple negative correlation made intuitive sense. Then crisis periods started to complicate the picture. In more recent shocks, gold and semis have sometimes moved together, or at least failed to deliver the clean inverse dance many investors expected.

ETFs

Rotation Signals Between Semi Product ETFs and Equipment ETFs (Based on CapEx Cycles)

Semiconductor themed ETFs are no longer moving as a single block. In the current cycle, product‑centric semi ETFs (designers, memory producers, integrated device makers) and equipment ETFs (tool and wafer fab equipment vendors) can lead or lag each other by wide margins. Those leadership changes are not random. They are tied to the semiconductor capital expenditure (capex) cycle. If you can read the capex signals correctly, you can often see rotations coming between product ETFs and equipment ETFs before they show up fully in performance charts.

HBM Memory

The HBM Capacity Expansion Race: SK Hynix, Samsung, Micron 2026 Capacity Map

In 2026 the high-bandwidth memory (HBM) market sits at a strategic crossroads. Driven by generative AI, large language models, high-performance computing (HPC), and advanced graphics, demand for stacked memory with ultra-high throughput continues to surge. This post maps the 2026 HBM capacity expansions from the three dominant players—SK Hynix, Samsung, and Micron—examines their strategies, regional footprints, technology choices, and the implications for customers, OEMs, and the supply chain.