His Articles

Thematic ETFs

Active Correction Strategies for the Systematically Underweighted Memory Weight in AI Compute Indices

Most AI compute indicators and ETFs are built around the obvious heroes: GPUs, accelerators, and custom AI chips. Memory—the bandwidth and capacity that feed those chips—often shows up as a supporting cast with smaller index weights. That systematic underweighting of memory in AI compute indicators is understandable from a market-cap and narrative perspective, but it is increasingly at odds with how AI infrastructure actually works. If memory is a bottleneck, underweighting it is not just a technical quirk; it is a structural allocation error.

Macro Cycle

2026 Global Semi CapEx Map: The Divergence Between Advanced and Mature Nodes

The semiconductor industry entered 2026 with a clearer, more bifurcated capital expenditure landscape than at any point in the past decade. As hyperscalers and AI-driven computing demands continue to escalate, foundries and integrated device manufacturers (IDMs) prioritize advanced-node capacity (3 nm, 2 nm and next-generation gate-all-around architectures).

Thematic ETFs

The Nonlinear Relationship Between AUM and Tracking Deviation for Memory ETFs

AI has turned memory—from DRAM and HBM to NAND and enterprise storage—into the central bottleneck of computing. As that happens, memory-focused ETFs have gone from niche to headline, with assets under management (AUM) exploding in a short span of time. Along the way, another, quieter variable starts to matter: tracking deviation. How closely do these funds actually follow the memory indices they promise to track? And how does that tracking behave as AUM grows from tiny to massive?

HBM Memory

Tracking the Spot vs. Contract Price Spread Dynamics in HBM Market

High-Bandwidth Memory (HBM) has transitioned from a boutique, high-margin specialty to a strategic commodity within high-performance computing and AI infrastructure. That transition created two distinct pricing channels: spot-market transactions (ad-hoc purchases, inventory sales, and opportunistic trades) and contract-based procurement (multi-year supply agreements, prepayments, and capacity reservations).

Compute Chips

The Profit Erosion Effect of Soaring Tape-Out Costs for China’s AI Chip Designers

In the last few years, China’s AI chip industry has moved from early experimentation to large‑scale commercial deployment, with dozens of design houses racing to tape out increasingly complex accelerators for data centers, edge devices, and vertical applications. At the same time, the cost of moving a design from layout to silicon—tape out—has risen sharply, driven by advanced process nodes, more complex packaging, and growing verification demands.