His Articles

ETFs

Hong Kong vs. Mainland Semi ETF Flows: The Cross-Border Pattern

There's a pattern that repeats every quarter, every earnings season, every macro inflection point. When semiconductor sentiment turns positive, Hong Kong-listed semi ETFs see inflows first—often 2-3 days before mainland China ETFs. When sentiment sours, mainland ETFs see outflows first—again, 2-3 days ahead of Hong Kong. The lag isn't random. It reflects capital controls, investor composition, trading hours, and the unique mechanics of cross-border ETF access. For investors tracking semiconductor ETF flows in Asia, understanding this pattern is alpha.

ETFs

Semi ETF AUM Growth: The Liquidity Premium Threshold

There's a number that every semiconductor ETF issuer watches: $1 billion. It's not a marketing milestone or a psychological round number. It's the liquidity premium threshold—the point at which an ETF's average daily volume (ADV) deepens enough to attract institutional capital, which in turn drives more AUM, which further deepens liquidity, creating a virtuous cycle. Below $1B, ETFs struggle with wide bid-ask spreads, limited institutional interest, and sluggish asset growth.

ETFs

The Liquidity Siphon Effect of Growing Semi ETF AUM on Constituent Passive Inflows

Semiconductor themed ETFs have moved from niche products to major pipelines for capital into the chip ecosystem. As their assets under management (AUM) grow, the way liquidity reaches individual semiconductor stocks is changing. More money is flowing through the ETF wrapper and less directly into single names, especially from passive and quasi‑passive investors. This shift raises an important question: is there a “liquidity siphon effect,” where growing semi ETF AUM channels more passive inflows into the ETF itself and away from direct constituent ownership?

Thematic ETFs

A Methodology for a Dedicated Memory Chip Index (Focusing on ASP and Bit Growth Dual Factors)

AI storage and computing power increasingly depend on one core ingredient: memory. DRAM, NAND, and especially HBM are no longer just cyclical commodities; they are central to the performance and economics of AI data centers. Yet most semiconductor indices still treat memory as one subsector among many, and most AI hardware indices mix memory exposure with compute and equipment in ways that can blur the underlying drivers. If you want a clean instrument for memory risk and opportunity, you need a dedicated memory chip index built around the actual economics of the business—above all, average selling prices (ASP) and bit growth.

HBM Memory

The Bundled Investment Thesis of HBM and CoWoS: Indispensable Pair

In modern high-performance computing and AI system design, High-Bandwidth Memory (HBM) and Chip-on-Wafer-on-Substrate (CoWoS) packaging have evolved from complementary technologies into a tightly coupled investment thesis. This post examines why investors, system architects, and policymakers should view HBM and CoWoS as an intertwined opportunity—how technological synergies, supply-chain economics, customer demand patterns, and geopolitical dynamics create a single strategic story rather than two separate bets.